Aim: LAB-3D-Mess seeks to industrialize a laser-based 3D manufacturing process for PCBs, aiming for sustainable and European-made electronic systems. This project aligns with the booming Industrial IoT sector, projected to reach 11.4 billion connected devices by 2025.
Description: The start-up Cyber-POD will develop a hybrid PCB fabrication technology, combining 3D printing and laser ablation. This innovative approach significantly shortens production time, supports small batch sizes, and improves customizability, representing 72% of the market.
Benefits: LAB-3D-Mess will offer substantial ecological advantages, reducing CO2 emissions 14 times and material waste 2.5 times, with no water waste. Additionally, it enhances supply chain resilience, ensures European manufacturing, and promotes digital continuity in quality monitoring.
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